IPG Photonics GLPN-40-1-20-M. · Laser Laboratory


IPG Photonics GLPN-40-1-20-M.

Nanosecond laser for precision laser scribing and cutting.

Our workhorse for laser cutting and scribing with high precision four-axis stage and a high-performance galvanometer scanner for repeatable µm accuracy at high speed.

Nanosecond laser for precision laser scribing and cutting.

Laser specifications

Parameter Value
Pulse width 1.5 ns (typical)
Wavelength 532 nm
Repetition rate 10-500 kHz
Power 20 W
Beam profile Gaussian beam profile
Micromachining setup
  • Four-axis stage with µm accuracy and 200 mm xy-scan range
  • Galvoscanner unit

Laser micromachining

Investigations into the application of lasers for micromachining of silicon are also being carried out, including the drilling and scribing of deep vias and trenches and the initiation of crystal plane selective silicon etching. Rapid creation of deep features with minimal micro-cracking or laser induced damage is relevant to various complex solar cell designs, and also allows for the utilisation of various test structures that can be used for characterision of laser and other solar cell fabrication processes.

High-precision stage with galvo scanner.

High-precision stage with galvo scanner.

The high-precision four-axis stage combined with a high-performance galvanometer scanner achieves µm accuracy at high speed over a scan area of 200 mm x 200 mm.